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首次亮相即斩获殊荣!AirJet® Mini 荣膺 COMPUTEX 2023 “金奖”​

首次亮相即斩获殊荣!AirJet® Mini 荣膺 COMPUTEX 2023 “金奖”​
Seshu Madhavapeddy CEO of Frore Systems, and Surya Ganti, CTO, with the Golden Award in Taipei.

During its debut at COMPUTEX 2023 Taipei, one of the worlds’ largest computer and technology events, AirJet® Mini, the world’s first solid state active cooling chip, was awarded the coveted “Golden Award” of Best Choice Award in the IC & Components category.

The Golden Award, awarded to products that demonstrate exceptional innovation, functionality and market potential, was established by COMPUTEX in 2002 to “help buyers find the most outstanding ICT products.”

A panel of independent judges from government, academia and research analysts, presented the award stating, “With the AirJet Mini, consumer electronics can achieve 2x the system performance while being smaller, thinner, lighter weight, dust-resistant, and quieter than other cooling alternatives. Frore Systems has created a new frontier in tech development with a solid-state active heat dissipating chip and all new thermal management algorithms. The chip allows for strategic market expansion and applications in new models for marketing product strategies.”

“We are honored to receive the COMPUTEX 2023 Golden Award of Best Choice Award in the IC & Component category,” said Dr. Seshu Madhavapeddy, founder and CEO of Frore Systems. “AirJet demonstrates the three key criteria evaluated for this award – innovation, functionality, and market potential. We are delighted that COMPUTEX 2023 has recognized AirJet and the significant impact we are making in all facets of the consumer electronics industry.”

AirJet solves the biggest challenge facing the tech world today - heat. AirJet cools devices with breakthrough technology to meet the ever-increasing demands of today’s consumers, delivering a 2x improvement in performance while operating in silence. AirJet’s compact size and unique capabilities enable faster, quieter, thinner, lighter, and dustproof devices.

Frore Systems launched AirJet in December 2023, and has seen unprecedented demand for the small and highly effective AirJet active cooling chip. The AirJet Mini is 2.8mm thick, 27.5mm x 41.5mm in size, and weighs just 9 grams. AirJet is scalable, meaning that multiple chips can be easily integrated into devices resulting in major performance gains. AirJet can enhance performance across numerous devices from Notebooks, Mini-PCs, smartphones and SSDs, to the approaching tsunami of IOT devices; doorbell cameras, WiFi access points and LED lighting, and in markets as diverse as the datacenter and automotive industries.

发布日期:
May 23, 2023
March 26, 2024

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